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NCV8403, NCV8403A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Drain ? to ? Source Voltage Internally Clamped
Gate ? to ? Source Voltage
Symbol
V DSS
V GS
Value
42
" 14
Unit
Vdc
Vdc
Drain Current
Continuous
I D
Internally Limited
Total Power Dissipation
@ T A = 25 ° C (Note 1)
@ T A = 25 ° C (Note 2)
Thermal Resistance ? SOT ? 223 Version
Junction ? to ? Case
Junction ? to ? Ambient (Note 1)
Junction ? to ? Ambient (Note 2)
Thermal Resistance ? DPAK Version
Junction ? to ? Case
Junction ? to ? Ambient (Note 1)
Junction ? to ? Ambient (Note 2)
Single Pulse Inductive Load Switching Energy
(V DD = 25 Vdc, V GS = 5.0 V, I L = 2.8 A, L = 120 mH, R G = 25 W )
Load Dump Voltage (V GS = 0 and 10 V, R I = 2.0 W , R L = 4.5 W , t d = 400 ms)
Operating Junction Temperature
Storage Temperature
P D
R q JC
R q JA
R q JA
R q JC
R q JA
R q JA
E AS
V LD
T J
T stg
1.13
1.56
12
110
80
2.5
95
50
470
55
? 40 to 150
? 55 to 150
W
° C/W
mJ
V
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Surface mounted onto minimum pad size (0.412 ″ square) FR4 PCB, 1 oz cu.
2. Mounted onto 1 ″ square pad size (1.127 ″ square) FR4 PCB, 1 oz cu.
+
I D
DRAIN
I G
+
VGS
?
GATE
SOURCE
VDS
?
Figure 1. Voltage and Current Convention
http://onsemi.com
2
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